According to the latest research report on the global Fully Automatic Flexible PCB Placement Equipment market by QYResearch Report, the sector is projected to expand from USD 2,213 million in 2024 to USD 3,156 million by 2031, growing at a compound annual growth rate (CAGR) of 5.2% during the forecast period from 2025 to 2031.
Key Market Trends in 2025
The global electronics manufacturing industry is witnessing transformative shifts in 2025, propelled by the surge in demand for lightweight, compact devices and groundbreaking innovations in flexible PCB technologies. Below is an in-depth overview of key trends shaping the market landscape this year.
1. Surge in Demand for Flexible Printed Circuit Boards (FPCs)
The market for flexible PCBs is expected to grow from USD 20.17 billion in 2024 to USD 22.62 billion in 2025, marking a CAGR of 12.17% through 2033. These PCBs are critical in foldable smartphones, wearable devices, automotive control units, and portable medical monitors. For instance, over 78% of foldable smartphones released in 2024 incorporated advanced FPCs, highlighting the component’s growing significance.
2. Advancements in AI-Based Auto-Routing and 3D Placement Optimization
Artificial Intelligence is redefining the design and manufacturing of flexible PCBs. AI-assisted auto-routing tools use deep learning to predict optimal paths for circuitry, significantly reducing design cycles. Meanwhile, 3D placement optimization minimizes electromagnetic interference and enhances accuracy in multilayer designs. This capability is increasingly essential as PCBs become denser and more multifunctional.
3. Panasonic Connect’s Technological Breakthrough
Panasonic Connect launched the NPM-GW Modular Placement Machine in early 2025. It incorporates real-time diagnostics, self-calibrating heads, and AI-powered predictive maintenance. With a mounting precision of ±15 μm and throughput reaching 51,000 components per hour, it sets a new industry benchmark for high-speed, miniaturized component placement.
4. Growth of the Wearable Medical Devices Sector
The wearable medical devices market is projected to hit USD 53.73 billion in 2025, growing at a CAGR of 25.90%. This growth is tightly linked with the adoption of FPCs in applications like heart rate sensors, continuous glucose monitors, and smart patches. Flex circuits enable the creation of ultra-thin, bendable devices that can be worn comfortably for extended periods.
5. AI Integration Across Manufacturing Processes
In 2025, AI is being integrated into nearly every aspect of PCB manufacturing. From predictive equipment maintenance to real-time process optimization, AI-driven systems are lowering operational costs, boosting yield, and improving responsiveness to supply chain dynamics. Manufacturers leveraging AI are seeing marked improvements in both efficiency and scalability.
As these trends unfold, fully automatic flexible PCB placement equipment continues to evolve rapidly, with performance, accuracy, and adaptability at the core of competitive differentiation in 2025.
Market Segmentation
By Type
High-speed Placement Equipment
Medium-speed Placement Equipment
Odd-form Component Placement Equipment
Multi-functional Placement Equipment
Others
By Application
Smartphone Manufacturing
Wearable Device Production
Automotive Electronics Assembly
Medical Electronics Assembly
Others
Regional Outlook
The Asia-Pacific region remains the largest market, followed by Europe and North America. With continued growth in electronics manufacturing, countries like China, Japan, and South Korea are expanding their investments in precision placement systems to cater to both consumer and industrial electronics.
Top Players in the Market
The global market is dominated by a group of leading companies, including:
ASMPT
Panasonic Connect
Fuji Corporation
Yamaha Motor IM
JUKI Corporation
Mycronic AB
Essemtec AG
Europlacer
Nordson Corporation
Siplace
Hanwha Precision Machinery
Samsung Techwin
Koh Young Technology
i-PULSE
Universal Instruments Corporation
Strategic Insights
The market is expected to experience shifts in capital allocation and industrial footprints due to potential changes in the 2025 U.S. tariff framework. Strategic sourcing, cross-border manufacturing, and localized component integration are becoming key considerations for equipment suppliers and OEMs alike.
Industry players are not only focusing on performance, but also on energy efficiency, adaptability for odd-form components, and modular expansion capabilities to meet future product iterations. As end-use devices shrink and integrate more functionality, placement precision and automation will remain at the core of competitiveness.
Related Reports：
Fully Automatic Flexible PCB Placement Equipment – Global Market Share and Ranking, Overall Sales and Demand Forecast 2025-2031
https://www.qyresearch.com/reports/4733852/fully-automatic-flexible-pcb-placement-equipment
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