The global market for Fully Automatic Flexible PCB Placement Equipment is projected to grow from USD 2.21 billion in 2024 to USD 3.16 billion by 2031, registering a compound annual growth rate (CAGR) of 5.2% during the forecast period 2025–2031, according to a new market study by QY Research.
Fully Automatic Flexible PCB Placement Equipment
Market Overview
Fully Automatic Flexible PCB Placement Equipment is a specialized high-precision automated system designed for the efficient and accurate placement of components on flexible printed circuit boards (FPCs). These machines are essential for manufacturing lightweight, compact, and high-performance electronics used in smartphones, wearables, automotive systems, and medical devices.
Market Trends and Developments in 2025
AI-Driven Automation
In 2025, artificial intelligence (AI) continues to revolutionize the electronics manufacturing sector, especially in the deployment of Fully Automatic Flexible PCB Placement Equipment. Companies like ASMPT and Panasonic Connect have launched AI-integrated placement platforms capable of real-time defect detection and adaptive component alignment. For instance, ASMPT’s recent Smart Factory solutions leverage AI to optimize machine learning-based component recognition, improving placement accuracy by up to 12% and reducing placement cycle times by nearly 15%.
According to a 2025 report by IPC and SMT Today, over 43% of new placement lines installed globally now include AI-enabled vision systems and predictive maintenance algorithms, a significant leap from 28% in 2023. These advancements reduce downtime and boost throughput, which are critical for high-volume production in sectors like smartphones and wearable tech.
Growing Demand from Wearables and Automotive Electronics
Flexible PCBs are essential for modern wearable devices and advanced automotive systems. In 2025, the global wearable electronics market is projected to exceed USD 142 billion, with flexible PCBs playing a vital role in enabling the miniaturization and reliability of these devices. Likewise, the automotive industry’s shift toward electric vehicles (EVs) and advanced driver-assistance systems (ADAS) is fueling demand for flexible, space-efficient PCBs.
Research from Deloitte (2025) shows that over 62% of automotive manufacturers are integrating flexible PCBs in EV control systems, infotainment, and safety electronics. Leading placement equipment manufacturers are responding by enhancing their machines’ capability to handle ultra-thin substrates and complex board layouts required in these applications.
Tariff and Geopolitical Shifts
Geopolitical developments in 2025, particularly involving the U.S.-China trade dynamics, are influencing supply chain strategies in the electronics manufacturing sector. With renewed tariff discussions under the revised U.S. Trade Policy Act, many OEMs are reevaluating their global sourcing and manufacturing footprints.
According to the World Trade Organization’s 2025 policy report, proposed U.S. tariffs on certain semiconductor and electronics-related imports could increase material costs by 7–12%. This has prompted key players to diversify operations to Southeast Asia, Mexico, and parts of Eastern Europe to hedge against policy risks and reduce production costs.
Furthermore, companies such as JUKI Corporation and Mycronic AB are actively investing in decentralized manufacturing hubs to maintain supply chain resilience and ensure consistent delivery to key markets amidst these fluctuations.
These developments are not only redefining the competitive landscape of the Fully Automatic Flexible PCB Placement Equipment market but also pushing innovation toward more intelligent, adaptable, and cost-efficient solutions tailored to rapidly evolving industry demands.
Key Players and Strategic Developments
As of 2024, the top global manufacturers include:
ASMPT
Panasonic Connect
Fuji Corporation
Yamaha Motor IM
JUKI Corporation
Mycronic AB
Essemtec AG
Europlacer
Nordson Corporation
Siplace
Hanwha Precision Machinery
Samsung Techwin
Koh Young Technology
i-PULSE
Universal Instruments Corporation
Notably, ASMPT introduced a next-generation placement platform in Q1 2025 that offers adaptive alignment and AI-enhanced vision systems, targeting high-density FPCs in smartphone assembly lines. Panasonic Connect expanded its IoT-based predictive maintenance system to boost uptime in 24/7 production environments.
Market Segmentation
By Type:
High-speed Placement Equipment
Medium-speed Placement Equipment
Odd-form Component Placement Equipment
Multi-functional Placement Equipment
Others
By Application:
Smartphone Manufacturing
Wearable Device Production
Automotive Electronics Assembly
Medical Electronics Assembly
Others
Regional Insights
Asia-Pacific remains the dominant market region due to extensive consumer electronics production bases in China, South Korea, and Japan. Europe and North America are also witnessing growing adoption, particularly in automotive and medical electronics sectors.
Driven by technological advancements, increasing automation, and rising demand from the consumer and automotive sectors, the Fully Automatic Flexible PCB Placement Equipment market is expected to see stable growth through 2031. Manufacturers are advised to invest in R&D, especially in AI and multifunctional placement capabilities, to maintain competitive advantage.
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